capabilities roadmap
Calumet Electronics has been manufacturing printed circuit boards in the USA since 1968. Over the years we have learned a lot about making boards and building partnerships. Mission-critical manufacturing maintains the process capability required to produce highly-reliable printed boards with dock-to-stock performance you can rely on. The following capability matrix is a snapshot of current, developing and planned process capabilities.
Feature | Standard | Advanced | Emerging |
|---|---|---|---|
Attributes | |||
Circuit Layers | 40 | 40+ | 54+ |
Largest Panel Size | 19.5″ x 22.5″ | 19.5″ x 22.5″ | 19.5″ x 22.5″ |
Laminate Materials | |||
Minimum Thickness | .012″ | .010″ | .008″ |
Maximum Thickness | .200″ | .280″ | .500″ |
Minimum Finished Core Thickness | .002″ | .0015″ | < .0015" |
Copper Weight (Inner) | .25 – 4oz Foil | .25 – 5oz Foil | .25 – 5oz Foil |
Copper Weight (Outer) | .25 – 4oz Foil | .25 – 4oz Foil | .25 – 4oz Foil |
Copper Weight (Finished) | Up to 5oz Plated | Up to 5oz Plated | Up to 5oz Plated |
FR4 Tg 140 | Yes | Yes | Yes |
FR4 Tg 170 | Yes | Yes | Yes |
Polymide | Yes | Yes | Yes |
Rogers | Yes | Yes | Yes |
Medium Loss: FR408 HR, -13EP | Yes | Yes | Yes |
Low Loss: I-Tera, Megtron 6, Tachyon, Astra | Yes | Yes | Yes |
Ultra Low Loss: Megtron 7, Meterorwave | Yes | Yes | Yes |
RoHs Materials | Yes | Yes | Yes |
Halogen Free | Yes | Yes | Yes |
Duroid | Yes | Yes | Yes |
Imaged Features | |||
Internal Circuit Trace / Space | .003″ / .003″ | .002″ / .002″ | Sub .002″ / .002″ |
External Circuit Trace / Space | .0035″ / .0035″ | .003″ / .003″ | Sub .002″ / .002″ |
Minimum Pad | .004″ | .0035″ | .003″ |
SMT Pitch | .50mm | < .50mm | < .25mm |
Controlled Impedance | 10% | < 10% | < 5% |
Drill (Via and PTH) Tolerances | |||
Minimum Drilled Hole Thickness (Mechanical) | .0059″ | .0039″ | < .0039" |
PTH Aspect Ratio | 12 : 1 | 16 : 1 | 18 : 1 |
Backdrill | Yes | Yes | Yes |
Via in Pad (non-conductive, epoxy) | Yes | Yes | Yes |
Via in Pad (conductive fill) | Yes | Yes | Yes |
Via in Pad – Copper Filled | Yes | Yes | Yes |
Soldermask | |||
Direct-Image LPI – Colors | Green, Blue, Black | Red, Clear, Matte Green
| Any Color |
Tented LPI | Coated with LPI | Coated/plugged | Coated/plugged |
Dryfilm Soldermask | No | Yes | Yes |
Minimum Clearance | .003″ | .002″ | < .002" |
Minimum Web | .004″ | .003″ | < .003" |
Surface Finishes | |||
Tin/Lead Solder Finish | 63 / 37 SnPb HASL | 63 / 37 SnPb HASL | 63 / 37 SnPb HASL |
Lead-Free Solder Finish | SN100C HASL | SN100C HASL | SN100C HASL |
Immersion Gold Finish (ENIG) | per IPC-4552 | per IPC-4552 | per IPC-4552 |
Immersion Silver Finish | per IPC-4553 (Thick) | per IPC-4553 (Thick) | per IPC-4553 (Thick) |
Gold Tabs | Yes | Yes | Yes |
HDI Capabilites | |||
Sequential Lamination | Yes (3 Lamination Cycles) | Yes (4 – 5 Lamination Cycles) | Yes (> 5 Lamination Cycles) |
Blind Vias | Yes | Yes | Yes |
Micro Vias (Mechanical and Laser) | Yes | Yes | Yes |
Blind Aspect Ratio | 1:1 | > 1 : 1 | > 1.5 : 1 |
Milled Cavities | Yes | Yes | Yes |
Copper Plated Through Holes | Yes | Yes | Yes |
Backdrill Features | Yes | Yes | Yes |
Test and Measurement | |||
Flying Probe Test | Yes | Yes | Yes |
Fixture Test (also double density) | Yes | Yes | Yes |
Ionics | Yes | Yes | Yes |
XRF | Yes | Yes | Yes |
OM D-Coupon Testing | Yes | Yes | Yes |
Hi-Pot Testing | Yes | Yes | Yes |
RF, Microwave, Beamforming | |||
RF/Mixed Builds | Yes | Yes | Yes |
Ormet Interconnects | Yes | Yes | Yes |
Castellations / Plated edges | Yes | Yes | Yes |
Buried Capacitance | Yes | Yes | Yes |
Embedded Resistance | Yes | Yes | Yes |
Semi Additive Processing | |||
Semi-Additive Trace (sub 25 micron) | No | Yes | Yes |
Semi-Additive with PTH and microvias | No | Yes | Yes |
Microvia Diameter (on BUF) | NA | 50µm | > 25µm |
Build-Up Film (ABF) | No | Yes | Yes |
Please contact us for further updates and/or specific interests.
